Thermal evaporator and sputtering system

The Department of Chemistry, Institute of Physical Chemistry, intends to purchase an integrated thermal evaporator and sputtering vacuum deposition system. Therefore, we invite offers from companies for a tool fulfilling the technical specifications as outlined in the corresponding RFT (see below)

The Department of Chemistry seeks to purchase an integrated thermal evaporator and sputtering vacuum deposition system designed for thin film depositions. The system is comprised of two modules: an evaporator and a sputtering system, integrated into a glove box that includes a 5-port shallow glovebox and a 2-port standard glove box on each side, assembled as outlined below. The evaporator component of the tool is intended for depositing both organic and inorganic compounds, such as C60, BCP, Spiro-TTB, CsBr, PbI2 as well as metals like Cu and
Ag (but not limited to these examples). The sputtering part of the system facilitates controlled deposition of transparent conductive oxides, such as IZO and ITO, metal oxides such as NiOx, along with metals like Ag, utilizing at least one soft-landing (minimizing particle energy) hollow cathode magnetron. This system will be utilized for fabricating perovskite solar cells of various sizes and for the different layers within the cell stack. Apart from the price of the equipment, the following technical specifications will be evaluated and considered in the decision making process:
Technical specifications and further requirements We plan a robotic arm upgrade on the tool in the future for automated sample and mask exchanges, therefore, if the offered tool does not have robotic arm upgradability, that offer is excluded. Both systems must be designed for future upgrades to accommodate automatic sample
loading-unloading via a load lock. The load lock, positioned between the two chambers, must be capable of storing at least 6 pcs of plates or masks. The transfer arm must facilitate the automatic exchange of samples within both the evaporator and sputtering system. The load lock undergoes pump-down by the rough pump and connects to the main chambers through gate valves. The system is prearranged for potential upgrades such as electrical connections, openings, and chamber designs. Also, transfer-capable substrate stage assembly must be integrated into both systems to enable the stage to move automatically up and down. Furthermore, as this constitutes a critical element of our project, we are seeking a reference from the company for at least one previously developed and operational system to enhance risk mitigation. Additionally, any offers exceeding a total tool price of €725K (w/o tax, including shipping) will be excluded from further evaluation. The quote must include the details of the 2-day operation and maintenance training course for the end users and the training must be provided in English.